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O2 Technology

O2 Technology

Semiconductor Company

  • Home
  • About Us
    • Our Mission
    • What we do
    • Who we are
  • Products
    • CMP Parts
      • Retainer Ring (2nd)
      • Multi-hole Slurry Nozzle
      • CMP PVA Brush
      • CMP Dresser Brush
      • CMP filter
      • CMP Rotary Joint
      • CMP 200mm Cylinder type Pad Conditioner Assembly
    • ESC (OPM & 2nd Source)
    • Photo Chuck (2nd Source)
    • N2 FOUP Purge System
      • Why N2 FOUP Purge?
      • For Diffusion Furnace
      • For Cluster Type
    • Heating Jacket
    • Bonded Slit Valve (BSV)
    • Dry Pump Power Saver (e-Saver)
    • Remote Control System
    • Vacuum Bellows
  • Refurb & Repair
    • Ozone Generator Repair & Overhaul
    • Robot Repair and Overhaul Services
    • RPS Repair
    • On-site Chamber Regen Service
    • Diffusion Refurbishment
      • Diff Furnace Refurbishment
      • Diff Furnace Relocation
      • TEL Fomula Refurbishment
    • CMP Repair
      • CMP Repair Workflow
      • CMP Repair Details
    • CMP Refurbishment
    • AlN Heater Repair
    • ElectroStatic Chuck Repair
      • ESC Repair Workflow
      • ESC Repair List
    • Photo Chuck Repair
    • Showerhead Repair
    • Implant Arc Chamber Repair
  • Fab Solutions
    • CMP Cost Reduction
      • Retaining Ring Refurbishment
      • Membrane Cleaning
      • Retaining Ring Cleaning
      • Slurry Multi-hole Nozzle
    • Controlling O2 and moisture inside Equipment
    • PEO coated RPS Block
    • Dry Pump Power Saving
  • Surplus
    • Available Equipment
    • Wanted Equipment
  • Information
    • Semiconductor News
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Products

  • CMP Parts & Consumables
    • CMP Brush
    • CMP Retainer Ring
  • CMP 200mm Cylinder type Pad Condtioner Head and Assembly
  • N2 FOUP Purge System
  • Heating Jacket
  • Bonded Slit Valve (BSD) Door
  • RCS (Remote Control System)

 

 

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